Film forming method and film forming device
US5015330A · kind A · utility
105Cited by
7References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 28, 1990 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | Feb 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/913
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming method comprises the steps of placing a plurality of objects to be processed and supplying an etching gas in a reaction container, removing a natural oxidization originated film on an object to be processed placed in the reaction container under a heating condition by plasma etching, exhausting the etching gas after stopping supply of the etching gas so as to stop making of the plasma, and supplying a film forming gas in the reaction container without rendering the reaction container open to air so as to form a film on the objects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.