Polishing pad with uniform abrasion
US5020283A · kind A · utility
214Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 3, 1990 |
| Grant date | Jun 4, 1991 |
| Priority date | — |
| Expiry date | Aug 3, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for semiconductor wafers, having a face shaped by a series of voids. The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.