Electronic packaging of components incorporating a ceramic-glass-metal composite
US5024883A · kind A · utility
37Cited by
23References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1989 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | Sep 14, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.