Patent · US Expired

High voltage, high speed Schottky semiconductor device and method of fabrication

US5027166A · kind A · utility

32Cited by
7References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 29, 1988
Grant dateJun 25, 1991
Priority date
Expiry dateNov 29, 2008

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S438/934

Abstract

A high voltage, high speed Schottky diode has an electrode of aluminum or like Schottky barrier metal formed on a semiconductor region to create a Schottky barrier therebetween. Also formed on the semiconductor region is a extremely thin resistive layer of, typically, oxidized titanium surrounding the barrier metal electrode and electrically connected thereto. The resistive layer also creates a Schottky barrier at its interface with the semiconductor region and serves to expand the depletion region due to the barrier metal electrode, thereby preventing the concentration of the electric field at the periphery of the barrier metal electrode and so enhancing the voltage withstanding capability of the diode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.