Apparatus for replacing defective electronic components
US5029747A · kind A · utility
7Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Aug 3, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.