Film carrier for mounting IC chips
US5031022A · kind A · utility
18Cited by
1References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 27, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Apr 27, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC chip is packaged on a film carrier. The film carrier comprises an insulation film and many conductive leads formed on the insulation film in predetermined patterns. Each of the leads has an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a conductive pattern of a mounting board. The film carrier further comprises an embankment, which is made of insulation material and formed on and/or in the vicinity of the outer lead portions of the leads to prevent an ooze of resin when the IC chip is sealed with the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.