Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
US5038195A · kind A · utility
2Cited by
6References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1990 |
| Grant date | Aug 6, 1991 |
| Priority date | — |
| Expiry date | Feb 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.