Method for the cooling of targets as well as cooling device for targets
US5039913A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1990 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Jun 4, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The rear surface of an sputtering target (1) is actively cooled exclusively in regions spaced from breakthrough-prone regions. The cooling takes place in regions along the erosion profile outside of the regions of greatest erosion rate. For this purpose a cooling device for the target (1) has channels (7) through which a coolant flows. These channels (7) extend outside the regions (4) of strongest erosion of the target (1). The cooling channels (7) have on the side facing the back surface of the target, one foil-like closure wall (10). The cooling channels (7) extend in a cooling plate (6) and are separated from each other by webs (8). The webs (8) extend in the region of strongest erosion (4) of the target (1) in order to mechanically support these regions (4). Therewith it is possible to utilize expensive target material to the limit of its removal, without however risking a breakthrough of the target due to the erosion in an area where coolant will leak.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.