Additive for acid-copper electroplating baths to increase throwing power
US5051154A · kind A · utility
30Cited by
11References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1990 |
| Grant date | Sep 24, 1991 |
| Priority date | — |
| Expiry date | Jan 29, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.