Lead design to facilitate post-reflow solder joint quality inspection
US5062567A · kind A · utility
10Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1990 |
| Grant date | Nov 5, 1991 |
| Priority date | — |
| Expiry date | May 1, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved lead for surface-mounted electronic components is described. The improved lead includes an opening through the portion of the lead to be placed in contact with the printed circuit board for soldering. The opening, having a diameter approximately equal to the thickness of the lead, enables the detection of correctly-soldered joints using automated inspection equipment. When the lead is correctly soldered, solder is drawn by capillary action into the opening where it forms a meniscus. By automatically detecting the curvature of the meniscus, the quality of the solder joint may be determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.