Plasma treatment method
US5064679A · kind A · utility
2Cited by
0References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Aug 27, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2037/903
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Method and apparatus for improving the surface quality of a resin molding by treating it with a plasma gas, measuring and integrating ion density and stopping the treatment when the integration reaches a predetermined value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.