Method for anisotropically hardening a protective coating for integrated circuit manufacture
US5064748A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 1989 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Dec 21, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/948
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for anisotropically hardening a protective coating to provides a well defined edge thereon for forming features which may be smaller than the resolution limit of the exposure equipment, for the purpose of integrated circuit manufacture. The method includes the steps of forming a non-planar coating on a substrate with a photoresist material having a sensitivity ot incident flux that varies as a function of the angle of the incidence of the flux upon the coating. The coating is anisotropically hardened by exposing it to flux to which it has a relatively high sensitivity so that portions for which the flux is incident at one angle are more hardened than those portions where the flux is incident at a different angle. Narrow trenches or studs may thereby be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.