Method for holding a plate-like member
US5065495A · kind A · utility
18Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1990 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Jun 8, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer receiving apparatus has a base, a table for supporting a wafer, a receiving member having at least three receiving pins which project from a supporting surface and are concealed under the supporting surface upon vertical movement of the table, and a driving unit for vertically moving the table. The wafer is transferred onto the receiving pins while the receiving pins project, and is held on the table while the receiving pins are concealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.