Electroplating composition and process
US5068013A · kind A · utility
17Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1990 |
| Grant date | Nov 26, 1991 |
| Priority date | — |
| Expiry date | Jan 29, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.