Device for solder removal
US5072873A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 1990 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | May 3, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/26
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device having a plurality of columnar structures comprised of a solderable metal disposed on a supporting base is used to remove solder from a substrate surface. Capillary action takes place in the area between the columns, thus removing the solder from the substrate surface. The present invention may be fabricated by forming columnar structures on the supporting base through mask openings or by etching a solderable metal layer into columnar structures. A standoff may be built into the device to prevent solder residue from remaining on the substrate surface between solder pads and to allow a controllable amount of solder to be left on the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.