Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
US5074969A · kind A · utility
7Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1991 |
| Grant date | Dec 24, 1991 |
| Priority date | — |
| Expiry date | Mar 7, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0393
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.