Plasma treating method and apparatus therefor
US5085750A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1989 |
| Grant date | Feb 4, 1992 |
| Priority date | — |
| Expiry date | Apr 14, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/32
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a plasma treating method and apparatus therefor, the plasma treating method comprising the steps of supplying a liquid refrigerant whose temperature is not higher than 0.degree. C. into a specimen table having a specimen place surface, cooling a specimen placed on the specimen place surface, treating the cooled specimen utilizing a gas plasma, and recovering the liquid refrigerant, in its liquid state, retained in the specimen table from the specimen table. The plasma treating apparatus comprised means for producing a gas plasma, a specimen table on which is placed a specimen to be treated utilizing the gas plasma and interiorly formed with a space for retaining a liquid refrigerant whose temperature is not higher than 0.degree. C., means for supplying the liquid refrigerant to the space, and means for recovering the liquid refrigerant, in its liquid state, to the liquid refrirant supplying means, whereby an increase in consumption quantity of the liquid refrigerant can be suppressed, and thus an increase in operating cost of the apparatus can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.