Limiting tin sludge formation in tin or tin-lead electroplating solutions
US5094726A · kind A · utility
9Cited by
37References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1990 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Sep 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.