Compliant thermally conductive compound
US5094769A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 1988 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | May 13, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.