Method and apparatus for applying a layer of a fluid material on a semiconductor wafer
US5094884A · kind A · utility
50Cited by
19References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1990 |
| Grant date | Mar 10, 1992 |
| Priority date | — |
| Expiry date | Apr 24, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus and method is disclosed for applying a uniform layer of a fluid material such as photoresist onto the surface of a rotating workpiece such as a semiconductor wafer. A dispensing nozzle is provided with a rectangular or oblong shaped opening for painting a broad swath of the fluid material onto the surface of the workpiece while the nozzle moves along a radial path inwardly from the peripheral edge of the workpiece. The use of a rectangular or oblong shaped nozzle opening minimizes the amount of fluid material being consumed while providing a uniform thin film coating on the workpiece surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.