Apparatus for transporting wafer to and from polishing head
US5095661A · kind A · utility
51Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1989 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Dec 18, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head. When the transport head assembly removes the wafer from the dolly and positions the wafer against the pressure head, the transport head assembly only contacts the wafer at selected points at the periphery of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.