Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant

US5106785A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Siegfried Rauchmaul · Munich, DE
• Hans-Fr. Schmidt · Eurasburg, DE
• Juergen Bednarz · Penzberg, DE
• Karl-Heinz Horsmann · Munich, DE
• Ralf Criens · Munich, DE
• Horst Scheffler · Munich, DE
• Hanns-Heinz Peltz

Key dates

• Filing date: Jan 16, 1990
• Grant date: Apr 21, 1992
• Expiry date: Jan 16, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49172
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.