Method of making a resin encapsulated pin grid array with integral heatsink
US5108955A · kind A · utility
71Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1991 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Feb 6, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.