Method of automatically chamfering a wafer and apparatus therefor
US5117590A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1989 |
| Grant date | Jun 2, 1992 |
| Priority date | — |
| Expiry date | Jul 19, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of automatically chamfering a wafer and an apparatus therefor are disclosed. The method comprises the steps of supplying a wafer, positioning and setting the wafer on working stages, chamfer-machining the wafer on the working stages, and recovering the wafer, all the steps being continuously performed on a full-automatic basis. The apparatus comprises a wafer supply means, a wafer positioning and setting means, a chamfer-machining means for the wafer, a wafer recovering means, and a wafer transferring means. Since the method and apparatus therefor enables performance of a series of those operations on a continuous and full-automatic basis, it is possible to enhance the operating efficiency and machining ability and, at the same time, to achieve manpower reduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.