Method of fabricating electrical components in high density substrates
US5120572A · kind A · utility
38Cited by
39References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 30, 1990 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Oct 30, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be connected selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors in relatively few steps. The process is well suited for cooper/polyimide substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.