Nalin Kumar
89Patents
28h-index
46Co-inventors
88Inventor score
Filing activity: Oct 30, 1990 → Jun 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5227013A | Forming via holes in a multilevel substrate in a single step | Emerging Cross-Sectional Technologies | 136 | Expired |
| US5199918A | Method of forming field emitter device with diamond emission tips | Electricity | 123 | Expired |
| US5449970A | Diode structure flat panel display | Electricity | 102 | Expired |
| US5399238A | Method of making field emission tips using physical vapor deposition of random nuclei as etch mask | Electricity | 94 | Expired |
| US5451551A | Multilevel metallization process using polishing | Electricity | 83 | Expired |
| US5926239A | Backlights for color liquid crystal displays | Electricity | 73 | Expired |
| US5382315A | Method of forming etch mask using particle beam deposition | Emerging Cross-Sectional Technologies | 69 | Expired |
| US5312514A | Method of making a field emitter device using randomly located nuclei as an etch mask | Electricity | 69 | Expired |
| US5118385A | Multilayer electrical interconnect fabrication with few process steps | Electricity | 58 | Expired |
| US5341063A | Field emitter with diamond emission tips | Electricity | 56 | Expired |
| US5380546A | Multilevel metallization process for electronic components | Electricity | 55 | Expired |
| US10207296B2 | Material sorting system | Physics | 53 | Active |
| US5551903A | Flat panel display based on diamond thin films | Emerging Cross-Sectional Technologies | 52 | Expired |
| US10710119B2 | Material sorting using a vision system | Physics | 45 | Active |
| US5548185A | Triode structure flat panel display employing flat field emission cathode | Electricity | 44 | Expired |
| US5543684A | Flat panel display based on diamond thin films | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5861707A | Field emitter with wide band gap emission areas and method of using | Electricity | 41 | Expired |
| US5120572A | Method of fabricating electrical components in high density substrates | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5164332A | Diffusion barrier for copper features | Electricity | 38 | Expired |
| US5156997A | Method of making semiconductor bonding bumps using metal cluster ion deposition | Electricity | 37 | Expired |
| US5254493A | Method of fabricating integrated resistors in high density substrates | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5536193A | Method of making wide band gap field emitter | Electricity | 34 | Expired |
| US5290732A | Process for making semiconductor electrode bumps by metal cluster ion deposition and etching | Electricity | 33 | Expired |
| US5445550A | Lateral field emitter device and method of manufacturing same | Electricity | 32 | Expired |
| US5317006A | Cylindrical magnetron sputtering system | Emerging Cross-Sectional Technologies | 31 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.