Wei Koh
38Patents
14h-index
22Co-inventors
81Inventor score
Filing activity: Oct 31, 1990 → Mar 29, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5493096A | Thin substrate micro-via interconnect | Electricity | 167 | Expired |
| US5599744A | Method of forming a microcircuit via interconnect | Electricity | 117 | Expired |
| US7652892B2 | Waterproof USB drives and method of making | Emerging Cross-Sectional Technologies | 81 | Expired |
| US5825084A | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | Electricity | 75 | Expired |
| US7317250B2 | High density memory card assembly | Electricity | 70 | Expired |
| US6686656B1 | Integrated multi-chip chip scale package | Electricity | 40 | Expired |
| US5135556A | Method for making fused high density multi-layer integrated circuit module | Electricity | 36 | Expired |
| US5075201A | Method for aligning high density infrared detector arrays | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5149671A | Method for forming multilayer indium bump contact | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5717247A | Microcircuit via interconnect | Electricity | 20 | Expired |
| US6737738B2 | Multi-level package for a memory module | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5393696A | Method for forming multilayer indium bump contacts | Emerging Cross-Sectional Technologies | 15 | Expired |
| US7623354B2 | Folding USB drive | Electricity | 15 | Active |
| US5475224A | Infrared detector substrate with breakaway test tabs | Physics | 15 | Expired |
| USD632696S1 | Biometric security memory storage card | General | 14 | Expired |
| US5209798A | Method of forming a precisely spaced stack of substrate layers | Performing Operations; Transporting | 13 | Expired |
| USD659146S1 | Biometric security memory storage card | General | 13 | Expired |
| US5128749A | Fused high density multi-layer integrated circuit module | Electricity | 12 | Expired |
| US5138164A | Infrared detector subarray with integral optical filter | Electricity | 10 | Expired |
| USD693816S1 | Biometric security memory storage card | General | 9 | Active |
| US7564359B2 | Memory module and card with integrated RFID tag | Electricity | 9 | Active |
| US8071895B2 | Waterproof USB drives and method of making | Emerging Cross-Sectional Technologies | 8 | Active |
| US10601968B1 | Foldable wedge-shaped mobile electronic device | Electricity | 7 | Active |
| US7411292B2 | Flash memory card | Electricity | 5 | Expired |
| US8203847B2 | Folding USB drive | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.