Electroplating method
US5135636A · kind A · utility
92Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1991 |
| Grant date | Aug 4, 1992 |
| Priority date | — |
| Expiry date | Sep 19, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating rack for use in electroplating at least one substrate includes a rack body onto which the substrate may be placed; a metal ring connected to the rack body so as to surround a substrate placed on the rack body; and bistable, single-tipped cam assemblies for holding a placed substrate in place and for making electrical contact between the metal ring and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.