Packaging for semiconductor logic devices
US5138434A · kind A · utility
253Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1991 |
| Grant date | Aug 11, 1992 |
| Priority date | — |
| Expiry date | Jan 22, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is faster and consumes less power because of its shorter trace lengths and smaller size, and is more reliable as a result of its greatly reduced number of interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.