Inventor · Boise, ID, US

Alan G. Wood

399Patents
80h-index
49Co-inventors
90Inventor score

Filing activity: Sep 30, 1988 → Jan 16, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US6235554A Method for fabricating stackable chip scale semiconductor package Electricity 674 Expired
US5739585A Single piece package for semiconductor die Emerging Cross-Sectional Technologies 523 Expired
US6013948A Stackable chip scale semiconductor package with mating contacts on opposed surfaces Electricity 456 Expired
US6841883B1 Multi-dice chip scale semiconductor components and wafer level methods of fabrication Electricity 455 Expired
US5674785A Method of producing a single piece package for semiconductor die Emerging Cross-Sectional Technologies 425 Expired
US6020629A Stacked semiconductor package and method of fabrication Electricity 382 Expired
US5495667A Method for forming contact pins for semiconductor dice and interconnects Emerging Cross-Sectional Technologies 365 Expired
US6097087A Semiconductor package including flex circuit, interconnects and dense array external contacts Electricity 365 Expired
US6114240A Method for fabricating semiconductor components using focused laser beam Electricity 321 Expired
US7393770B2 Backside method for fabricating semiconductor components with conductive interconnects Emerging Cross-Sectional Technologies 312 Expired
US5851845A Process for packaging a semiconductor die using dicing and testing Emerging Cross-Sectional Technologies 303 Expired
US5483741A Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice Emerging Cross-Sectional Technologies 301 Expired
US7498675B2 Semiconductor component having plate, stacked dice and conductive vias Electricity 273 Active
US6107109A Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate Electricity 260 Expired
US5138434A Packaging for semiconductor logic devices Electricity 253 Expired
US5686317A Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die Emerging Cross-Sectional Technologies 245 Expired
US6169329A Semiconductor devices having interconnections using standardized bonding locations and methods of designing Electricity 243 Expired
US6908784B1 Method for fabricating encapsulated semiconductor components Electricity 234 Expired
US4899107A Discrete die burn-in for nonpackaged die Physics 229 Expired
US5593927A Method for packaging semiconductor dice Electricity 223 Expired
US6228687A Wafer-level package and methods of fabricating Electricity 223 Expired
US6294837A Semiconductor interconnect having laser machined contacts Electricity 223 Expired
US5990566A High density semiconductor package Electricity 223 Expired
US5541525A Carrier for testing an unpackaged semiconductor die Electricity 218 Expired
US5408190A Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die Electricity 214 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.