Semiconductor assembly utilizing elastomeric single axis conductive interconnect
US5140405A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1991 |
| Grant date | Aug 18, 1992 |
| Priority date | — |
| Expiry date | Mar 29, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An semiconductor assembly includes at least one die having substantially planar first and second engagement surfaces and external edges which define a die shape. A base having an opening formed therein receives the die. The base opening has peripheral edges which define an opening shape and size which is complementary to the die external shape. The opening edges engage the die edges to spatially fix the die in a selected orientation in a plane parallel to the die first planar engagement surface. An interconnecting plate has at least one substantially planar engagement surface facing the first planar engagement surface of the die received within the base opening. At least one conductive pad on the plate planar engagement surface is spatially aligned or registered with a corresponding conductive pad on the first engagement surface of the die. A sheet of anisotropically conductive elastomeric material is interposed between the base and interconnecting plate between the first engagement surface of the die and engagement surface of the interconnecting plate. The base and interconnecting plate are clamped relative to one another in selected registration, sandwiching the anisotropically c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.