Electroless plating of nickel onto surfaces such as copper or fused tungston
US5147692A · kind A · utility
256Cited by
18References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 1991 |
| Grant date | Sep 15, 1992 |
| Priority date | — |
| Expiry date | Apr 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.