Method of handling magnetic semiconductor wafers
US5147828A · kind A · utility
5Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1989 |
| Grant date | Sep 15, 1992 |
| Priority date | — |
| Expiry date | Dec 14, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer is provided with magnetic material about the periphery for magnetically clamping the wafer on a seating gasket at the processing station. The seating gasket is annular for peripherally supporting the wafer. An electro-magnet establishes a peripheral station magnetic field which attracts the wafer magnetic material to form the clamp. The station magnetic field may by reversed to levitate the wafer onto and off of the seating gasket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.