Apparatus for aligning wafers within a semiconductor wafer cassette
US5149244A · kind A · utility
12Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1991 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Jun 17, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improvement which allows precise positioning of wafers within cassettes in preparation for removal of the wafers by automated equipment. The improvement includes mounting two sawtooth jigs upon the surface upon which the cassette tray is to be placed which extend up into the cassette. Wafers within the cassette rest within the precisely aligned grooves of the sawtooth jigs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.