Resin-encapsulated semiconductor device having a particular mounting structure
US5150193A · kind A · utility
66Cited by
11References
28Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 11, 1991 |
| Grant date | Sep 22, 1992 |
| Priority date | — |
| Expiry date | Feb 11, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.