Semiconductor device having dual electrical contact sites
US5157480A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1991 |
| Grant date | Oct 20, 1992 |
| Priority date | — |
| Expiry date | Feb 6, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact portion which are separated by an intermediate portion. A package body encapsulates the semiconductor device die and intermediate portions of the plurality of leads. The first contact portions of the leads are partially exposed on the bottom surface of the package body. The second contact portions extend from the package body along a portion of the package body perimeter. The first contact portions provide bottom-side contacts to the device, while the second contact portions provide peripheral contacts. The second contact portions are shaped into a desired lead configuration or are severed to establish a leadless device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.