Heat pipe-electrical interconnect integration for chip modules
US5161090A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1991 |
| Grant date | Nov 3, 1992 |
| Priority date | — |
| Expiry date | Dec 13, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48472
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for controlling the temperature of one or more electrical component chips positioned on a face of a substrate and for providing component-to-component electrical interconnect traces between the chips. One or a selected set of electrical interconnections, contained within the substrate and connected to a chip, is also connected to a column of high electrical and thermal conductivity material within the substrate that is in direct thermal contact with the working fluid in a heat pipe. The heat pipe is sealed and is contained in the substrate interior and is in electrical and thermal contact with the electronic components on a chip. The heat pipe working fluid receives heat from the electronic components through the thermally conducting column, changes phase through absorption of this heat, and transports the heat to heat dissipation means located elsewhere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.