Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
US5161093A · kind A · utility
157Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1990 |
| Grant date | Nov 3, 1992 |
| Priority date | — |
| Expiry date | Jul 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.