Silicided structures having openings therein
US5166770A · kind A · utility
10Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1987 |
| Grant date | Nov 24, 1992 |
| Priority date | — |
| Expiry date | Apr 15, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Preferred embodiments include silicon complementary MOSFETs with titanium silicided junctions (38, 58) and direct contacts of aluminum metallization (61, 62) to the p junctions (58) which avoids the high contact resistance of the silicide (60) to p silicon (58). Preferred embodiments also include silicided polysilicon lines without corresponding silicided MOSFET junctions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.