Patent · US Expired

Silicided structures having openings therein

US5166770A · kind A · utility

10Cited by
5References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 15, 1987
Grant dateNov 24, 1992
Priority date
Expiry dateApr 15, 2007

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Preferred embodiments include silicon complementary MOSFETs with titanium silicided junctions (38, 58) and direct contacts of aluminum metallization (61, 62) to the p junctions (58) which avoids the high contact resistance of the silicide (60) to p silicon (58). Preferred embodiments also include silicided polysilicon lines without corresponding silicided MOSFET junctions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.