Polishing pad
US5177908A · kind A · utility
207Cited by
4References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 1990 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Jan 22, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for semiconductor wafers, having a face shaped to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece. The favored face shape is a sunburst pattern having nontapered rays, coaxial with the pad's rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.