Method of making a resin encapsulated pin grid array with integral heatsink
US5179039A · kind A · utility
21Cited by
11References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 1991 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | May 15, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.