Patent · US Expired

Method of forming a layer of doped crystalline semiconductor alloy material

US5180690A · kind A · utility

60Cited by
14References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 9, 1990
Grant dateJan 19, 1993
Priority date
Expiry dateJul 9, 2010

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S148/122
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for the low temperature fabrication of doped polycrystalline semiconductor alloy material. The method includes the steps of exposing a body of semiconductor alloy material to a reaction gas containing at least a source of the dopant element, and establishing an electrical potential sufficient to sputter etch the surface of said layer, while decomposing the reaction gas. This allows for the deposition of a layer of doped amorphous semiconductor alloy material upon the body of semiconductor alloy material. Thereafter, the doped layer of amorphous semiconductor alloy material is exposed to an annealing environment sufficient to at least partially crystallize said amorphous material, and activate the dopant element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.