Electrical and/or thermal interconnections and methods for obtaining such
US5189261A · kind A · utility
29Cited by
34References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1990 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Oct 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.