Joseph Hromek
3Patents
3h-index
14Co-inventors
51Inventor score
Filing activity: Sep 27, 1974 → May 7, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5880590A | Apparatus and method for burn-in and testing of devices with solder bumps or preforms | Electricity | 69 | Expired |
| US3999004A | Multilayer ceramic substrate structure | Electricity | 37 | Expired |
| US5189261A | Electrical and/or thermal interconnections and methods for obtaining such | Emerging Cross-Sectional Technologies | 29 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.