Dipping type surface treatment apparatus
US5191908A · kind A · utility
33Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1991 |
| Grant date | Mar 9, 1993 |
| Priority date | — |
| Expiry date | Dec 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A dipping type wafer treatment apparatus includes housing having first and second openings, a wafer treatment bath provided inside the housing, a clean air unit for producing a downflow, a flow rectifier for introducing the downflow into the housing, a communicating chamber provided below the housing being partitioned from a space inside the housing, a duct for guiding mist in the vicinity of the treatment bath in the housing into the communicating chamber together with the downflow, and a pump for forcing air out of the communicating chamber from an air outlet provided in the communicating chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.