Dielectric composition and solder interconnection structure for its use
US5194930A · kind A · utility
103Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1991 |
| Grant date | Mar 16, 1993 |
| Priority date | — |
| Expiry date | Sep 16, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.