Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5200362A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1991 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Sep 9, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around the die, one side of the conductive traces, and the interconnecting means. The film of transfer material forms, at this stage of the process, one side of the package. The film of transfer material is then peeled from the pattern of conductive traces and the resin body to expose the other side of the pattern of conductive traces. Contact to the other side of the pattern provides electrical contact to the senmiconductor device die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.