Exposed die-attach heatsink package
US5200809A · kind A · utility
266Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 1991 |
| Grant date | Apr 6, 1993 |
| Priority date | — |
| Expiry date | Sep 27, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for packaging an integrated-circuit die in a conventional molded-plastic package exposes the lead frame to which the integrated-circuit die is attached so that heat-conducting columns can be directly attached to the leadframe through vias formed in the molded plastic package. The vias expose selected areas of the lead-frame to which are attached the thermally conductive columns, which extend to an exterior surface of the molded plastic package so that the lead-frame and the conductive columns provide a path for conduction of heat from the die to the exterior of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.