Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology
US5205770A · kind A · utility
124Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1992 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Mar 12, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/8625
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Fabrication of spacer supports for use in field emitter displays through a process which involves 1) forming a mold for the spacers in a substrate through the use of micro-saw technology, 2) filling the mold with a material that is selectively etchable with respect to the mold, 3) optionally, planarizing the excess material to the level of the mold using chemical mechanical planarization, 4) attaching the filled mold to one of the electrode plates of the field emitter display, and 5) etching away (removing) the mold, after which 6) the plate can be aligned with its complementary electrode plate, and 7) a vacuum formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.