Ceramic electrostatic wafer chuck
US5207437A · kind A · utility
43Cited by
13References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1991 |
| Grant date | May 4, 1993 |
| Priority date | — |
| Expiry date | Oct 29, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An electrostatic chuck for semiconductor wafers comprised of a multilayered ceramic, including a back-side-metal layer pattern adjacent the upper wafer receiving surface for generating an electrostatic force. Intermediate via layers connect the pattern to a back-side-metal layer at the bottom of the chuck to which power leads can be connected. A number of small passages, extending from the bottom of the chuck to its upper surface, allow helium heat transfer without the need for surface grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.